Sung Oh Special Research
First published 2026.08.14 · Revised 08.16
Cover · Image
Illustration of financial documents and certificates rising like columns of light from a GPU inside a dark data center
SUNG OH Special Research
2026.08.14

Interest on the Chip

AI's bottleneck has shifted from power to capital

P1 EVENT
ISSUE 00CAPITAL BOTTLENECKTERM / SHEET
Special Research2026.08.14 · The Rewiring of AI Capital

Can a GPU
Become a Bond?

How AI compute becomes a financial asset · Following the chain of events around the August 10 announcement

2026.08.10 Announcement · At a Glance
Who
NVIDIA · Apollo · BlackRock · Blackstone · Brookfield · Goldman Sachs · KKR
When
August 10, 2026 (local time) · Memorandum of Understanding (MOU)
Where
United States · NVIDIA Newsroom
What
More than $500bn Third-party capital target · financing platforms dedicated to AI compute
How
Six independently operated platforms · raise institutional capital · provide loans and investments to NVIDIA customers
Why
A judgment that customer financing has become the next bottleneck
Where the bottleneck widened
2023
GPU supply
2025
HBMand power
2026
Customer financing · the bottleneck highlighted by the August 10 announcement
After chips and power, capital has become a bottleneck too.
What the announcement explicitly states
Platforms
Six · independently operated · independently underwritten
Capital
Target of mobilizing more than $500bn of third-party capital
Terms
Dedicated pools of capital at “attractive rates”
Condition precedent
Subject to execution of definitive agreements
Still undisclosed
Allocation by firm · interest rates · maturities · loss sharing
Immediately after the announcement · equity and credit
ItemTimingValue
NVIDIA share priceAug. 10-2.4%Market capitalization fell by $130bn
NVIDIA share priceAug. 11Rebounded intradayClosed roughly flat
5-year CDSAug. 11Around 72bpNarrowed 5bp in one day
5-year CDS peakLate July82bp

Equity and credit sent different signals · the point where they diverged is the debate on page 4

That day, Wall Street lined up not for the chips,
but for the money those chips could earn.

P2 HISTORY
ISSUE 01COLLATERAL EVOLUTIONASSET / GRADE
01 · HISTORY

From buying chips
to lending against them

Three years of rehearsal came first · CoreWeave was the proving ground

The lineage of GPU-backed financing
TimingFinancingCollateral and rating
2023.08CoreWeave
Led by Blackstone · Magnetar
$2.3bnEquipment itself
2024.05CoreWeave
Led by Blackstone
$7.5bnEquipment · customer contractsAt the time, one of the largest-ever deals in private credit
2026.03CoreWeave
Blackstone Credit Anchor investor
$8.5bnGPUs and customer contractsThe financing structure itself received the first investment-grade rating · Moody's A3 · DBRS A(low)
2026.06IREN
Goldman Sachs · JPMorgan
$3.65bnGPUs and Microsoft contractHighest rating among disclosed GPU financings · Fitch A · DBRS A(low)

Evolution of the collateral · equipment → equipment plus customer contracts → the financing structure itself · The GPU itself did not become an A-rated asset · roughly two months to the second case

Structure of the March 2026 deal
Structure
Non-recourse · assets ring-fenced in a separate legal entity
Rating
Moody's A3 · DBRS A(low)
Structuring
Mitsubishi UFJ (MUFG) · Morgan Stanley
Order book
Oversubscribed
Terms already disclosed
Floating SOFR+2.25% · fixed about 5.9% · matures March 2032
IREN deal: blended financing cost of 6.00%
Investment grade is the threshold.It substantially widens the door to regulated institutional capital such as pension funds and insurers
$8.5bnFinancing backed by GPUs and customer contracts received an investment-grade rating for the first time · March 2026
A safeguard NVIDIA had already put in place
ItemDetails
Covered assetCoreWeave's unsold cloud capacity
SizeUp to $6.3bn
TermApril 2032

Like the August announcement, NVIDIA takes on part of the downside risk · but the floor is under a different layer

A priced object · labels and ratings turn collateral into a financial asset
PHOTO A · COLLATERAL / RATINGA priced object · labels and ratings turn collateral into a financial asset
P3 MECHANICS
ISSUE 02WHY GPU BECAME COLLATERALVALUE / CURVE
02 · MECHANICS

Why did GPUs become collateral?

Factory machinery can be collateral too · the question is whether there is a market to sell it into

Four pillars—and the fifth
The company that can erode the collateral value is also the company that may be able to put a floor under it.Every debate around this financing structure starts here
$500bnThird-party capital targeted by the platforms · a target before commitments are signed
P4 STRUCTURE
ISSUE 03COMPUTE FINANCE ROUTINGCAPITAL / FLOW
03 · STRUCTURE

How do the platforms work?

Capital moves through four arrows · NVIDIA sits outside that path and touches only the final one

Institutional capital Pension funds · insurers · sovereign wealth funds 1 Capital contribution Six financing platforms Independent underwriting · independent operation 2 Loans Customers · special-purpose vehicles (SPVs) AI labs · cloud providers · enterprises 3 GPU purchase GPU infrastructure Rental income · usage fees 4 Repayment from rental income NVIDIAUp to 25% residual-value support per deal · form not yet specified

Diagram · solid lines show the announced flow of funds · dotted line shows support NVIDIA said it “may” provide · the actual form is still unspecified

What CEO Jensen Huang said on X on Aug. 11
$500bn
The figure is the total amount of third-party capital—not NVIDIA revenue and not a commitment to any specific fund or customer
Underwriting
Conducted independently by each of the six firms
Role
Supplements rather than replaces independent underwriting
Support
Up to 25% per selected deal Residual-value support
Undisclosed
Whether the 25% is measured against principal, asset value or loss amount · and under what conditions payment would actually be made
Numbers circulating together
ItemFigureRole
Residual-value support capUp to 25% per dealJensen Huang's statement
25% × $500bn$125bnArithmetic extrapolationNot a commitment announced by NVIDIA
OpenAI Ohio backstopUp to $250bnSeparate matter · reported as under discussionLate July 2026
Same deal scaled downBelow $120bnLimited to the first phase2026.08.14 WSJ · concern over investors' risk exposure

$125bn is a number produced by a calculator · support is assessed deal by deal · the cap says “up to” · actual exposure could be far smaller or zero · The scale of guarantees and allocation of risk remain fluid

25%NVIDIA's stated cap on residual-value support per deal · basis and payment conditions undisclosed
Comments from the six firms in the announcement
P5 DEBATE
ISSUE 04ASSET CLASS OR CIRCULARITYTWO / READINGS
04 · DEBATE

A new asset class,
or Circular Financing 2.0?

The same announcement produced two readings · start by placing the facts each side relies on next to each other

Bull case · birth of an asset class
  • Larry Fink · BlackRock CEO · likened it to the rise of 1970s-era mortgage-backed securities (MBS)
  • Logic · if computing usage fees become the underlying cash flow, the structure begins to resemble infrastructure debt backed by roads or power plants
  • Rationale · Big Tech balance sheets alone cannot fund the required scale
Critique · circularity with a different source of capital
  • Circular financing 2.0 · only the source of money has changed to somebody else's capital · the destination is still purchases of NVIDIA products
  • Bank of NVIDIA · an extension of vendor financing · echoing the telecom-equipment bubble
  • Still unproven · investment-grade examples remain few · CoreWeave has now been followed by IREN, but the long-term repayment track record is still short
The number beneath the bull case · 2027 hyperscaler capex
ScenarioAmount
Market consensus$920bn
Goldman Sachs base caseAbout $1.1tn
Goldman Sachs high case$1.4tn

A view that funding needs could exceed what the market currently expects · these forecasts should not be mapped directly onto the platforms' $500bn target because the time frames and scopes differ · the platform figure is a cumulative target to be raised over time, not for a single year

Jensen Huang's rebuttal—and the rebuttal to that rebuttal

The direction of the money has not changed.
What changed is who owns that money.

Two faces of the same flow · the bull case and circular-financing critique read the same announcement differently
PHOTO B · TWO READINGSTwo faces of the same flow · the bull case and the circular-financing critique read the same announcement differently
P6 RISK
ISSUE 05STRESS MAPWRONG / WAY
05 · RISK

What could break the structure?

Repayment capacity rests on GPU usage fees and customer contracts · if those fail, residual value is what remains at the end

AI demand slowdown Lower rental rates ASIC · TPU Faster new-chip cycles Data-center oversupply Power shortages GPU rental income The core repayment cash flow

Diagram · pressure from six directions converges on one point: repayment cash flow · the weakness is that these pressures may not arrive separately

When all six overlap
The support provider's capacity and the collateral value could weaken in the same direction.Credit markets call this wrong-way risk· which is why the first questions after the announcement came from the bond side of the market
P7 KOREA
ISSUE 06KOREA TRANSMISSIONORDER / PATH
06 · KOSPI

Bringing the chain back to Korea

If the capital bottleneck eases, more chips can ship · and the order books of the components inside them can follow

A link that already reaches Korea · announcement on July 24, 2026
CounterpartyTimingDetails
SK GroupJuly 24local timeAI factory · expanded next-generation memory partnership
NAVER · BrookfieldJuly 24local timeKorean AI factory 55MW → 200MWNVIDIA plans $1bn investment · Brookfield non-binding term sheet for up to $9bn

Brookfield is one of the six firms in the August 10 platforms · it is already involved in the Korean buildout · the SK Group deal is separate and is not added to this figure

A conditional link, not a direct beneficiary call
The table below contains forecasts produced independently of this announcement.If the platforms translate into actual financing and orders, they could reduce some of the GPU-demand risk embedded in these forecasts
2027 HBM assumptions · Kiwoom Securities 2026.08.11
ItemSamsung ElectronicsSK hynix
HBM operating profitKRW 83tnKRW 70tn
Growth in the same metric+315%+138%
HBM shipments+109%Not separately disclosed
HBM blended ASP+81%Not separately disclosed

The estimates rest on an assumption that GPU shipments continue to rise · the same report also projected Samsung Electronics regaining the No. 1 HBM position

Three steps remain before this becomes an investment thesis
01
The MOU must become definitive agreements
02
The first financing mustclose
03
That capital must translate into actual orders
Orders not yet placed · the financing architecture is ready, but several steps remain before actual orders arrive
PHOTO C · PENDING ORDEROrders not yet placed · the financing architecture is being prepared, but several boxes remain before actual orders arrive
P8 CONCLUSION · DARK
ISSUE 07CONCLUSIONCASH / FLOW
07 · CONCLUSION

What becomes a bond
is not the chip, but the rent

The answer is a qualified yes

The chip
remains collateral
The substance of the bond
Rental income and the customer contracts that promise that income
If the contracts are strong
the structure starts to resemble debt backed by roads or power plants
If the contracts are weak
all that remains is estimating the resale value of used chips
Where things stand now
CoreWeave showed the path · August 10 was a declaration that the path could be widened to $500bn
The distance still separating declaration from market
MOU
Pre-contract stage
Rates · loss sharing
Blank
Residual-value support
Still at the “may provide” stage
Next checkpoints
2026.08.26
NVIDIA Q2 earnings
Whether management comments on the platforms
Timing TBD
Execution of definitive agreements
Disclosure of rates · maturities · loss sharing
Timing TBD
First financing close · the rate on that deal will become the first real price of this market
Conditions that would invalidate the thesis

The chip is only the collateral.
What becomes the bond is the money the chip is expected to earn.

Appendix
Appendix
One-Line Glossary · 19 terms
Memorandum of Understanding (MOU)
A document that agrees on the broad framework for cooperation before definitive contracts are signed. It is generally weakly binding.
Third-party capital
Capital raised from outside institutions such as pension funds and insurers. Distinguished from the parties' own balance-sheet capital.
Private Credit
Money lent directly to companies by private funds and asset managers. Distinguished from bank loans and public corporate bonds.
Anchor investor
An investor that commits a large amount early to help a deal close and attract other investors.
Investment Grade
A credit rating of Baa3 or above on Moody's scale. A key threshold that broadens access to large pools of regulated pension and insurance capital.
Non-recourse financing
A loan in which lenders cannot claim against the parent company if the borrower defaults; recovery is limited to the pledged assets and the cash flows they generate.
Residual value
The value remaining in an asset after its primary use. For GPUs, this is measured through resale value.
Residual-value support
A mechanism designed to protect the downside in an asset's residual value. For this transaction, both the basis and payment conditions remain undisclosed.
Backstop
A safety-net commitment to absorb losses at the end if a transaction fails.
CDS
The premium paid to insure against a company's default risk. A higher number means the market is more concerned about repayment.
Circular financing
A funding loop in which money provided by a vendor passes through its customer and returns as revenue to the vendor.
Vendor financing
Financing in which a seller lends the buyer money to purchase its product. Often cited because it has previously inflated apparent demand.
Mortgage-Backed Securities (MBS)
A bond backed by pooled mortgage repayment cash flows. The market began in the United States in the 1970s.
Wrong-Way Risk
The risk that a guarantor's ability to pay deteriorates at the same time the guarantee is most likely to be called.
CUDA
NVIDIA's GPU-centric software ecosystem. It broadens the potential buyer base for used GPUs.
HBM
High Bandwidth Memory stacked alongside GPUs. SK hynix and Samsung Electronics lead the market.
FC-BGA
An advanced semiconductor substrate that mounts high-performance chips in flip-chip configuration. Demand is especially strong for GPUs and servers.
ASIC
A custom chip designed for specific workloads. It can be cheaper and more power-efficient than a general-purpose GPU.
TPU
Google's AI accelerator. Google Cloud and some large customers use it instead of GPUs for certain workloads.
Sources · 16 items
  • NVIDIA Newsroom · NVIDIA Partners With Apollo, BlackRock, Blackstone, Brookfield, Goldman Sachs and KKR · company release · 2026.08.10 · Source
  • Blackstone Press Release · full comments from the CEOs of the six firms · company release · 2026.08.10 · Source
  • NVIDIA Blog · NVIDIA AI Factory Compute Is Becoming an Investable Asset Class · company release · 2026.08.11 · Primary source for the 25% residual-value support statement
  • CoreWeave IR · $7.5bn financing · company release · 2024.05.17 · Source
  • CoreWeave IR · $8.5bn · first investment-grade GPU-backed financing · company release · 2026.03.31 · Source
  • IREN Press Release · IREN Closes $3.65bn Investment-Grade GPU Financing · company release · 2026.06.01 · Fitch A · DBRS A(low) · Source
  • CNBC · CoreWeave $7.5bn financing · Jordan Novet · 2024.05.17 · the 2023 $2.3bn deal follows the Reuters figure cited in this article
  • CNBC · Nvidia lines up $500 billion financing · Jensen Huang · Larry Fink interview · 2026.08.10 · primary source for Fink's MBS analogy
  • CoreWeave SEC Filing · NVIDIA commitment to purchase unsold capacity · Form 8-K · 2025.09 · primary source for $6.3bn and April 2032 · Source
  • WSJ · Nvidia scales back funding guarantee for Ohio OpenAI data center · citing Reuters · 2026.08.14 · basis for report that the amount was reduced to below $120bn
  • Forbes · Nvidia Stock Loses $130 Billion In Market Value · Antonio Pequeño IV · 2026.08.10 · based on the Aug. 10 close of -2.4%
  • Fortune · Nvidia taps Wall Street for $500 billion funding commitment · 2026.08.11 · the 25% language in Jensen Huang's X post and reporting on the OpenAI backstop discussions are cited from this article
  • Seoul Economic Daily · “NVIDIA credit concerns ease after capping AI support at 25%” · 2026.08.11 · source for CDS figures
  • Goldman Sachs Research · 2027 hyperscaler capex outlook · Ryan Hammond · consensus $920bn · base about $1.1tn · high case $1.4tn · Media citation basis
  • NewsPim GAM · “NVIDIA's Circular Financing 2.0? The AI debt loop spreads to Wall Street” · Lee Hong-kyu · 2026.08.11
  • Kiwoom Securities · “HBM's Surge, General Memory Peak-Out” · Park Yoo-ak · 2026.08.11 · the same report cut target prices for Samsung Electronics from KRW 390,000 to KRW 350,000 and SK hynix from KRW 2.2mn to KRW 2.1mn · Buy ratings maintained · general-purpose DRAM projected to fall in the 30% range in 2027

This material is provided for informational purposes only and is not a recommendation to buy or sell any specific security. Forecasts cited are estimates by the respective institutions and may differ from actual results. Final investment decisions and responsibility rest with the investor.